Ho khutlisetsa lihlahisoa tse fosahetseng ho zero ke senotlolo sa ho tsoela pele ho ntlafatsa boleng ba sehlahisoa.Sebaka sa boemo ba lisebelisoa le boemo bo nyane le tlhahlobo ea sesosa bakeng sa lihlahisoa tse nang le phoso hape ke mokhoa oa bohlokoa oa ho khutsufatsa linako tsa ntlafatso ea sehlahisoa le ho fokotsa likotsi tsa boleng.
E shebane le theknoloji e kopaneng ea tlhahlobo ea ho hloleha ha potoloho, GRGT e na le sehlopha sa litsebi tse etelletseng pele indastering le lisebelisoa tse tsoetseng pele tsa tlhahlobo ea ho se atlehe, ho fa bareki tlhahlobo e felletseng ea ho se atlehe le lits'ebeletso tsa tlhahlobo, ho thusa bahlahisi ho fumana liphoso kapele le ka nepo le ho fumana sesosa sa ho hloleha ho hong le ho hong. .Ka nako e ts'oanang, GRGT e na le bokhoni ba ho fihlela litlhoko tsa R&D ho tsoa ho bareki, ho amohela lipuisano tsa tlhahlobo ea ho se atlehe tlasa lits'ebetso tse fapaneng, ho thusa bareki ho etsa moralo oa liteko, le ho fana ka lits'ebeletso tsa tlhahlobo le tlhahlobo, joalo ka ho sebelisana le bareki ho etsa netefatso ea ts'ebetso ea NPI. , le ho thusa bareki ho phethela tlhahlobo ea ho hloleha ha batch mohatong oa tlhahiso ea bongata (MP).
Lisebelisoa tsa elektroniki, lisebelisoa tse ikhethang, lisebelisoa tsa motlakase, lithapo le likhokahano, li-microprocessors, lisebelisoa tsa logic tse hlophisehang, memori, AD/DA, likhokahano tsa libese, li-circuits tse akaretsang tsa dijithale, switch ea analog, lisebelisoa tsa analog, lisebelisoa tsa microwave, phepelo ea motlakase jj.
1. Therisano ea tlhahlobo ea ho hloleha ha NPI le ho theha lenaneo
2. RP/MP Failure Analysis & Scheme Puisano
3. Tlhahlobo ea ho hlōleha ha boemo ba chip (EFA/PFA)
4. Tlhahlobo ea ho hlōleha ha tlhahlobo ea botšepehi
Mofuta oa tšebeletso | Lintho tsa tšebeletso |
Tlhahlobo e sa senyeheng | X-Ray, SAT, OM tlhahlobo ea pono |
Litšobotsi tsa motlakase / tlhahlobo ea sebaka sa motlakase | Tekanyo ea curve ea IV, Emission ea Photon, OBIRCH, tlhahlobo ea ATE le mocheso oa 3 (mocheso oa kamore / mocheso o tlase / mocheso o phahameng) netefatso |
Tlhahlobo e senyang | Plastic de-capsulation, delamination, board-level slicing, chip-level slicing, push-pull force test |
Tlhahlobo ea microscopic | Tlhahlobo ea karolo ea DB FIB, tlhahlobo ea FESEM, tlhahlobo ea likarolo tsa sebaka se senyenyane sa EDS |
Ke khoebo ea pele e thathamisitsoeng ho Sisteme ea Thepa ea 'Muso oa Guangzhou ka selemo sa 2019 le k'hamphani ea boraro e thathamisitsoeng ka karolo ea A tlasa Guangzhou Radio Group.
Bokhoni ba ts'ebeletso ea tekheniki ea k'hamphani bo eketsehile ho tloha ho fana ka tekanyo e le 'ngoe le ts'ebeletso ea calibration ka 2002 ho isa lits'ebeletso tse felletseng tsa tekheniki tse joalo ka tekanyo ea lisebelisoa le tlhahlobo, tlhahlobo ea sehlahisoa le setifikeiti, lipuisano tsa mahlale le koetliso, ho kenyeletsoa tekanyo le ho lekanya, ho ts'epahala le tlhahlobo ea tikoloho, le motlakase. teko ea ho lumellana.Sekala sa lits'ebeletso tsa sechaba bakeng sa mela ea khoebo se maemong a holimo indastering.