E akaretsa li-digital, analog, digital-analog hybrid le mefuta e meng ea li-chip.
● CP teko ea hardware moralo
Thepa ea lisebelisoa tsa teko ke karete ea phini, e sebelisetsoa ho hokahanya pakeng tsa ATE le DIE.
● FT teko ea lisebelisoa tsa thepa
Thepa ea liteko ke loadboard+socket+changekit, e sebelisetsoang ho leka khokahano ea 'mele lipakeng tsa lisebelisoa le chip e pakiloeng.
● Netefatso ea boemo ba boto
Ho aha tikoloho ea "chip" e sebetsang, leka ts'ebetso ea chip kapa u hlahlobe hore na chip e ka sebetsa ka mokhoa o tloaelehileng libakeng tse fapaneng tse thata.
● tlhahlobo ea SLT
Mosebetsi oa teko tikolohong ea sistimi ho bona boleng, le mokhoa oa tlatsetso oa FT, haholo bakeng sa lisebelisoa tsa SOC.
The Integrated Circuit Testing and Analysis Division ke setsi se ka sehloohong sa tlhahlobo ea boleng ba boleng ba semiconductor le ho tšepahala lenaneong la ntlafatso ea litšebeletso tsa tekheniki, e tsetetse lisebelisoa tse fetang 300 tsa tlhahlobo le tlhahlobo ea boemo bo phahameng, e thehile sehlopha sa talenta le lingaka le litsebi e le motheo, 'me e thehile 8. liteko tse khethehileng.E fana ka tlhahlobo ea ho se atlehe ha profeshenale le tlhahiso ea boemo ba wafer bakeng sa likhoebo tse maemong a tlhahiso ea lisebelisoa, likoloi, lisebelisoa tsa elektroniki tsa motlakase le matla a macha, likhokahano tsa 5G, lisebelisoa tsa optoelectronic le li-sensor, lipalangoang tsa seporo le lisebelisoa, le masela.Tlhahlobo ea ts'ebetso, tlhahlobo ea likarolo, tlhahlobo ea ts'epo, tlhahlobo ea boleng ba ts'ebetso, setifikeiti sa sehlahisoa, tlhahlobo ea bophelo le lits'ebeletso tse ling li thusa lik'hamphani ho ntlafatsa boleng le ts'epahalo ea lihlahisoa tsa elektroniki.
Litheko tsa rona li ka fetoha ho latela phepelo le lintlha tse ling tsa 'maraka.Re tla u romella lenane le ntlafalitsoeng la litheko kamora hore k'hamphani ea hau e iteanye le rona bakeng sa tlhaiso-leseling e batsi.