Lisebelisoa tsa bohlokoa bakeng sa mekhoa ea ho hlahloba microanalysis li kenyelletsa: optical microscopy (OM), double-beam scanning electron microscopy (DB-FIB), scanning electron microscopy (SEM), le transmission electron microscopy (TEM).Sengoliloeng sa kajeno se tla hlahisa molao-motheo le ts'ebeliso ea DB-FIB, e shebaneng le bokhoni ba ts'ebeletso ea metrology ea seea-le-moea le thelevishene DB-FIB le ts'ebeliso ea DB-FIB tlhahlobong ea semiconductor.
DB-FIB ke eng
Dual-beam scanning electron microscope (DB-FIB) ke sesebelisoa se kopanyang beam ea ion e tsepamisitsoeng le seketsoana sa elektrone ho microscope e le 'ngoe,' me e na le lisebelisoa tse kang gas injection system (GIS) le nanomanipulator, e le ho finyella mesebetsi e mengata. joalo ka etching, deposition ea lintho tse bonahalang, micro le nano processing.
Har'a bona, lebone le tsepamisitsoeng la ion (FIB) le potlakisa sefate sa ion se hlahisoang ke mohloli oa mokelikeli oa gallium tšepe (Ga), ebe o lebisa tlhokomelo holim'a sampuli ho hlahisa matšoao a bobeli a elektronike, 'me o bokelloa ke mochine.Kapa sebelisa beam ea ion e matla ea hona joale ho beha mohlala oa sebaka bakeng sa ts'ebetso ea micro le nano;Motsoako oa 'mele oa sputtering le lik'hemik'hale tsa khase ea lik'hemik'hale le tsona li ka sebelisoa ho khetha kapa ho beha litšepe le li-insulators.
Mesebetsi ea mantlha le lits'ebetso tsa DB-FIB
Mesebetsi ea mantlha: ts'ebetso e tsitsitseng ea likarolo tse fapaneng, ho lokisoa ha sampole ea TEM, etching e khethiloeng kapa e ntlafalitsoeng, ho beoa ha thepa ea tšepe le ho beoa ha lera la insulate.
Sebaka sa kopo: DB-FIB e sebelisoa haholo ho lisebelisoa tsa ceramic, lipolymer, lisebelisoa tsa tšepe, biology, semiconductor, jeology le likarolo tse ling tsa lipatlisiso le tlhahlobo ea lihlahisoa tse amanang.Haholo-holo, bokhoni bo ikhethang ba phetiso ea lintlha tse tsitsitseng tsa DB-FIB bo etsa hore e se ke ea nkeloa sebaka ke bokhoni ba tlhahlobo ea ho hloleha ha semiconductor.
GRGTEST DB-FIB bokhoni ba tšebeletso
DB-FIB hajoale e hlomelloa ke Shanghai IC Test and Analysis Laboratory ke Helios G5 letoto la Thermo Field, e leng letoto la Ga-FIB le tsoetseng pele ka ho fetisisa 'marakeng.Letoto lena le ka fihlela liqeto tsa ho lekola beam ea elektrone ka tlase ho 1 nm, 'me le ntlafalitsoe ho latela ts'ebetso ea beam ea ion le boiketsetso ho feta moloko o fetileng oa microscope ea li-elektronike tse peli.DB-FIB e na le li-nanomanipulator, lisebelisoa tsa ente ea khase (GIS) le EDX ea matla a matla ho kopana le litlhoko tse fapaneng tsa tlhahlobo ea ho hloleha ha semiconductor ea mantlha le e tsoetseng pele.
E le sesebelisoa se matla sa tlhahlobo ea ho hloleha ha thepa ea 'mele ea semiconductor, DB-FIB e ka etsa machining ea likarolo tse fapaneng ka nepo ea nanometer.Ka nako e ts'oanang ea ts'ebetso ea FIB, lebone la elektronike le nang le qeto ea nanometer le ka sebelisoa ho shebella morphology ea microscopic ea likarolo tse fapaneng le ho sekaseka sebopeho ka nako ea nnete.Finyella ho beoa ha lisebelisoa tse fapaneng tsa tšepe (tungsten, platinum, joalo-joalo) le lisebelisoa tse seng tsa tšepe (khabone, SiO2);Lilae tse tšesaane haholo tsa TEM le tsona li ka lokisoa sebakeng se tsitsitseng, se ka fihlelang litlhoko tsa tlhahlobo ea qeto e phahameng haholo maemong a athomo.
Re tla tsoelapele ho tsetela ho lisebelisoa tse tsoetseng pele tsa elektroniki, ho ntlafatsa le ho holisa bokhoni bo amanang le tlhahlobo ea ho se atlehe ha semiconductor, le ho fa bareki litharollo tse felletseng le tse felletseng tsa tlhahlobo ea ho se atlehe.
Nako ea poso: Apr-14-2024